? semiconductor components industries, llc, 2009 january, 2009 ? rev. 0 1 publication order number: mmbd301m3/d MMBD301M3T5G silicon hot-carrier diode schottky barrier diode the MMBD301M3T5G device is a spin ? off of our popular sot ? 23 three ? leaded device. it is designed primarily for high ? efficiency uhf and vhf detector applications. it is readily adaptable to many other fast switching rf and digital applications and is housed in the sot ? 723 surface mount package. this device is ideal for low ? power surface mount applications where board space is at a premium. features ? extremely low minority carrier lifetime ? 15 ps (typ) ? very low capacitance ? 1.5 pf (max) @ v r = 15 v ? reduces board space ? this is a halide ? free device ? this is a pb ? free device maximum ratings rating symbol value unit reverse voltage v r 30 v total device dissipation @ t a = 25 c derate above 25 c p f 200 2.0 mw mw/ c operating junction temperature range t j ? 55 to +125 c storage temperature range t stg ? 55 to +150 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. electrical characteristics (t a = 25 c unless otherwise noted) characteristic symbol min typ max unit reverse breakdown voltage (i r = 10 a) v (br)r 30 ? ? v total capacitance (v r = 15 v, f = 1.0 mhz) figure 1 c t ? 0.9 1.5 pf reverse leakage (v r = 25 v) figure 3 i r ? 13 200 nadc forward voltage (i f = 1.0 madc) figure 4 v f ? 0.38 0.45 vdc forward voltage (i f = 10 madc) figure 4 v f ? 0.52 0.6 vdc http://onsemi.com 30 volts silicon hot ? carrier detector and switching diodes device package shipping ? ordering information MMBD301M3T5G sot ? 723 (pb ? free) 8000/tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd801 1/d. sot ? 723 case 631aa style 2 1 2 3 ak m ak = specific device code m = date code marking diagram 1 anode 3 cathode
MMBD301M3T5G http://onsemi.com 2 typical electrical characteristics figure 1. total capacitance v r , reverse voltage (volts) figure 2. minority carrier lifetime i f , forward current (ma) figure 3. reverse leakage v r , reverse voltage (volts) figure 4. forward voltage v f , forward voltage (volts) , forward current (ma) i f , reverse leakage ( a) i r 0.2 0.4 0.6 0.8 1.0 1.2 100 10 0 6.0 12 18 24 10 1.0 0.1 0.01 0.001 01020 500 0 0 3.0 6.0 9.0 12 15 21 1.6 30 24 27 18 1.2 0.8 0.4 f = 1.0 mhz t a = -40 c t a = 85 c t a = 25 c 1.0 0.1 30 40 50 60 70 80 100 90 krakauer method 0 2.8 2.4 2.0 30 t a = 100 c 75 c 25 c , total capacitance (pf) c t , minority carrier lifetime (ps) 400 300 200 100 sinusoidal generator ballast network (pads) sampling oscilloscope (50 input) pads capacitive conduction forward conduction storage conduction dut i f(peak) i r(peak) figure 5. krakauer method of measuring lifetime
MMBD301M3T5G http://onsemi.com 3 package dimensions style 2: pin 1. anode 2. n/c 3. cathode sot ? 723 case 631aa ? 01 issue c dim min nom max millimeters a 0.45 0.50 0.55 b 0.15 0.21 0.27 b1 0.25 0.31 0.37 c 0.07 0.12 0.17 d 1.15 1.20 1.25 e 0.75 0.80 0.85 e 0.40 bsc h 1.15 1.20 1.25 l 0.15 0.20 0.25 0.018 0.020 0.022 0.0059 0.0083 0.0106 0.010 0.012 0.015 0.0028 0.0047 0.0067 0.045 0.047 0.049 0.03 0.032 0.034 0.016 bsc 0.045 0.047 0.049 0.0059 0.0079 0.0098 min nom max inches e notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeters. 3. maximum lead thickness includes lead finish. minimum lead thickness is the minimum thickness of base material. 4. dimensions d and e do not include mold flash, protrusions or gate burrs. d b1 e b e a l c h ? y ? ? x ? x 0.08 (0.0032) y 2x e 1 2 3 1.0 0.039 mm inches scale 20:1 0.40 0.0157 0.40 0.0157 0.40 0.0157 0.40 0.0157 0.40 0.0157 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting t echniques reference manual, solderrm/d. soldering footprint* on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, in cluding without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different a pplications and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical e xperts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc prod uct could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indem nify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney f ees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was neglig ent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 mmbd301m3/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc a sales representative
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